The characteristics of film deposition by glow discharge sputtering on cylindrical substrates sitting on the anode surface are examined. In normal dc sputtering, the deposited mass is greater at the upper part of a substrate than at the lower part. But with asymmetric ac sputtering, it is found that the deposit distribution is more uniform, because sputtered particles arrive not only from the cathode but also from the anode. High quality Ta film resistors of tubular type are being produced with this technique.
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