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首页> 外文期刊>Physical review, B. Condensed matter and materials physics >Defects and carrier compensation in semi-insulating 4H-SiC substrates
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Defects and carrier compensation in semi-insulating 4H-SiC substrates

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Electron paramagnetic resonance (EPR) studies revealed that vacancies (V_c and V_(Si)), carbon vacancy-antisite pairs (V_CC_(Si)) and the divacancy (V_CV_(Si)) are common defects in high-purity semi-insulating (HPSI) 4H-SiC substrates. Their concentrations and some of their deep acceptor levels were estimated by EPR and photoexcitation EPR. The commonly observed thermal activation energies, E_a~0.8-0.9 eV, ~1.1 eV, ~ 1.25-1.3, and ~1.5 eV, as determined from the temperature dependence of the resistivity, in different types of HPSI substrates were associated to different deep acceptor levels of V_(Si), V_C, V_CC_(Si), and V_CV_(Si). The annealing behavior of these vacancy-related defects and their interaction at high temperatures (up to 1600℃) in HPSI materials were studied. Carrier compensation processes were proposed to explain the observed change of the thermal activation energy due to high temperature annealing. V_C and V_CV_(Si) were suggested to be suitable defects for controlling the SI properties whereas the incorporation of V_(Si) and V_CC_(Si) during the crystal growth or processing should be avoided for achieving stable HPSI materials.

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