3d simulation package for electromagnetic phenomena

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3d simulation package for electromagnetic phenomena

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France-based ESI Group has introduced the 2002 version of its virtual prototyping and manufacturing package, PAM-CEM Solutions. This version includes many new features for the virtual testing of complex electromagnetic phenomena and is designed to analyse electromagnetic compatibility and interference problems so that manufacturers can streamline the product development process. The enhanced user environment reduces the implementation phase. Most native CAD data can be imported using the Geomesh module, while existing mesh, from Nastran, DXF or STL, can be directly handled through the enhanced discrete surface feature.

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《Wire Industry: Wire Industry with Wire Industry Yearbook》 |2002年第825期|533-0|共1页
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正文语种英语
中图分类导电材料及其制品;拉制、拉拔;
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3d simulation package for electromagnetic phenomena

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