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Microstructural developments in TLP bonds using thin interlayers based on Ni-B coatings

机译：使用基于Ni-B涂层的薄中间层的TLP键的微结构发展

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摘要

Oxide dispersion strengthened alloy MA 758 was transient liquid phase (TLP) bonded using thin interlayers based on Ni-B electrodeposited coatings and the microstructural developments across the joint region were studied. The bonding surfaces were electrodeposited with a coat thickness of 2-9 mu m and microstructural features were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. The homogeneity of the joint was assessed performing micro-hardness test. The results showed that the coating thickness as well as the amount of melting point depressants (boron) in the coatings had a significant effect on the microstructural developments within the joint region. TLP bonds made using a 2 mu m thick coating interlayer produced a joint with no visible precipitate formation and parent metal dissolution, and the absence of precipitates was attributed to the lower volume concentration of boron in the 2 mu m thick coating interlayer.
机译：使用基于Ni-B电沉积涂层的薄中间层，将氧化物弥散强化的合金MA 758瞬态液相（TLP）键合，并研究了整个接头区域的微观结构发展。结合表面被电沉积，涂层厚度为2-9微米，并通过扫描电子显微镜和能量色散X射线光谱学表征其微观结构特征。通过进行显微硬度测试来评估关节的均匀性。结果表明，涂​​层厚度以及涂层中熔点降低剂（硼）的含量对接头区域内的微结构发展有重大影响。使用2μm厚的涂层夹层制成的TLP键产生的接头没有可见的沉淀形成和母体金属溶解，并且不存在沉淀是由于2μm厚的涂层夹层中硼的体积浓度较低。

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