Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment

Kwang-Lung Lin; Chih-Chun Hsiao; Kaug-I Chen

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Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment

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The Pb-free Sn-Ag-Cu-Al solders were investigated for microstructural evolution with respect to Al percent and heat treatment. The Al percent varies from 0.1 percent to 0.45 percent while the contents of Ag are 3.1 percent-2.53 percent and of Cu are 0.41 percent-0.33 percent. Differential scanning colorimetry (DSC) was applied to identify the melting behavior. A monotectic temperature of 224 deg C and a eutectic temperature of 220 deg C are deduced from the DSC results. The microstructure was characterized with x-ray diffraction and scanning electron microscopy-energy dispersive spectroscopy. Ag_3Sn and the gamma_2 phase of Al-Cu system are the intermetallic compounds formed in the as-cast solders. Cu_6Sn_5 formed upon heat treatment for 1000 h at 150 deg C in the 0.45 Al-containing solder, while not found in the other solders or other heat treatment conditions. Sn whiskers were detected in a 0.45 Al-containing specimen after aging for 50 h.

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《Journal of Materials Research》 |2002年第9期|2386-2393|共8页
作者
Kwang-Lung Lin; Chih-Chun Hsiao; Kaug-I Chen;
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作者单位

Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种英语
中图分类工程材料学;
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Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment

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