...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of heat transfer: Transactions of the ASME >Optical measurement of thermal contact conductance between wafer-like thin solid samples
【24h】

Optical measurement of thermal contact conductance between wafer-like thin solid samples

机译：

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This paper presents a noncontact optical technique for measuring the thermal contact conductance between wafer-like thin solid samples. The technique is based on heating one solid surface by a modulated laser beam and monitoring the correspondingtemperature modulation of the other solid surface across the interface using the reflectance of a probe laser beam. The phase lag between the two laser signals is independent of the optical properties of the samples as well as the laser intensities, andcan be related to the thermal contact conductance. A detailed theoretical analysis is presented to estimate the thermal contact conductance as well as the thermophysical properties of the solids from the phase lag measured as a function of the modulationfrequency. Closed-form solutions in the high frequency limit are derived in order to provide a simple estimation procedure. The effect of misalignment of the two lasers is studied and the conditions for robust measurements are suggested. As a benchmarkfor this technique, the thermal conductivity of a single crystal silicon sample was measured to within two percent of reported values. The thermal contact conductance was measured for Al-Si samples, each about 0.22 mm thick, in the pressure range of0.8-10 MPa. In contrast to traditional contact conductance measurement techniques that require steady-state operation and insertion of thermocouples in thick solid samples, the noncontact dynamic optical technique requires much less time and isparticularly well suited for electronic packaging materials that are typically in the thickness range of 0.1-5 mm. In addition, localized conductance measurements are now possible with a spatial resolution of about four times the thickness of the solidand can be used to detect interfacial voids and defects.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号