Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds

Tianbao Du; Ming Liu; Steve Seghi

首页> 外文期刊>Journal of Materials Research >Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds

【24h】

Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds

机译：

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

A new experimental technique for determining mechanical properties of polymer-metal interfaces was developed by replacing the conventional mechanical testing machine with a piezoelectric actuator. The actuator was made from a thin ferroelectric ceramic beam attached to a bilayer polymer-metal composite specimen. The trilayer specimen was loaded by applying ac electric fields on the piezoelectric actuator to drive crack growth along the polymer-metal interface. Subcritical crack growth was observed along the epoxy/aluminum interface, and the growth rate was found to depend on the magnitude of the applied electric field. The fracture mechanics driving force for the crack growth was computed from the finite element analysis as a function of crack length, applied field, material properties, and specimen geometry. Kinetics of the crack growth was correlated with the piezoelectric driving force.

著录项

来源
《Journal of Materials Research》 |2001年第10期|2885-2892|共8页
作者
Tianbao Du; Ming Liu; Steve Seghi;
展开▼
作者单位

展开▼
收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种英语
中图分类工程材料学;
关键词

相似文献

外文文献
中文文献

1. Microtensile Bond Strength, Bonding Interface Morphology, Adhesive Resin Infiltration, and Marginal Adaptation of Bulk-fill Composites Placed ?Using Different Adhesives. [J] . Maicon Sebold, Rodrigo Barros Esteves Lins, Beatriz Ometto SahadiMarina Rodrigues SantiLuís Roberto Marcondes MartinsMarcelo Giannini The journal of adhesive dentistry . 2021,第5期

机译：Microtensile Bond Strength, Bonding Interface Morphology, Adhesive Resin Infiltration, and Marginal Adaptation of Bulk-fill Composites Placed ?Using Different Adhesives.
2. Fatigue crack propagation properties of toughness epoxy adhesives under model I loading (effects of glass-bead reinforcement/rubber modification and adhesive thickness on crack growth) [J] . Kimiyoshi Naito, Toru Fujii 日本機械学会論文集, A編 . 1997,第612期

机译：Fatigue crack propagation properties of toughness epoxy adhesives under model I loading (effects of glass-bead reinforcement/rubber modification and adhesive thickness on crack growth)
3. Fatigue crack propagation of rubber toughened epoxy adhesives under mode I loading (effects of rubber content and adhesive thickness on fatigue crack growth) [J] . Katsumasa Miyazaki, Toru Fujii 日本機械学会論文集, A編 . 1995,第586期

机译：Fatigue crack propagation of rubber toughened epoxy adhesives under mode I loading (effects of rubber content and adhesive thickness on fatigue crack growth)
4. First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =電子封裝中的第一級互連：合金銀互聯金屬生長動力學和他們的機械可靠性對線束的影響 [D] . Tobias, Russell Howard. 2019

机译：First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连：合金银互联金属生长动力学和他们的机械可靠性对线束的影响
5. Vibration control of structures with self-sensing piezoelectric actuators incorporating adaptive mechanisms. [O] . 2002

机译：Vibration control of structures with self-sensing piezoelectric actuators incorporating adaptive mechanisms.
6. Creep Crack-Growth: A New Path-Independent Integral (T sub C), and Computational Studies [R] . Stonesifer, R. B., Atluri, S. N. 1982

机译：Creep Crack-Growth：一种新的与路径无关的积分（T sub C）和计算研究

Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds

摘要

著录项

相似文献

相关主题

期刊订阅