Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

Dan Yang; B. Y. Wu; Y. C. ChanK. N. Tu

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Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

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The thermomigration behavior of eutectic tin-lead flip chip solder joints at an ambient temperature of 150℃ was investigated in terms of microstructural evolution, atomic transport, and numerical simulation. Pb accumulation and phase separation were observed in solder joints near a melting temperature after 50 h, which was supported by energy dispersive x-ray and element mapping analysis. It is believed that Pb atoms migrated from the chip side (the hot side) to the substrate side (the cold side) under a temperature gradient. Thermal electrical finite element simulation for the real flip chip test structure showed the existence of a temperature difference between the substrate side and the chip side. In addition, a temperature gradient above 1000 ℃/cm across the adjacent unpowered solder joints was predicted. This was also verified by temperature measurements with thermocouples. The atomic flux of Pb due to thermomigration was calculated here, which was agreeable with the values originally reported. Also, the driving force of thermomigration was estimated to be 10~(-17) N, even approaching the same order with that of electromigration under a current density of 10~4 A/cm~2.

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《Journal of Applied Physics》 |2007年第4期|043502.1-043502.6|共9页
作者
Dan Yang; B. Y. Wu; Y. C. ChanK. N. Tu;
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作者单位

Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue,Kowloon Tong, Hong Kong;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
原文格式 PDF
正文语种英语
中图分类应用物理学;计量学;
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1. Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology [J] . J. W. Jang, A. P. De Silva, T. Y. LeeJ. K. LinD. R. Frear Applied physics letters . 2001,第4期

机译：Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology
2. Electromigration of eutectic SnPb and SnAg_(3.8)Cu_(0.7) flip chip solder bumps and under-bump metallization [J] . T. Y. Lee, K. N. Tu, D. R. Frear Journal of Applied Physics . 2001,第9期

机译：Electromigration of eutectic SnPb and SnAg_(3.8)Cu_(0.7) flip chip solder bumps and under-bump metallization
3. Electromigration of eutectic SnPb solder interconnects for flip chip technology [J] . Lee TY., Kuo SM., Frear DR.Tu KN. Journal of Applied Physics . 2001,第6期

机译：Electromigration of eutectic SnPb solder interconnects for flip chip technology

Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

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