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首页> 外文期刊>Journal of Applied Physics >Response to 'Comment on 'Unexpected size effect in the thermopower of thin-film stripes'' J. Appl. Phys. 115, 236101 (2014)
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Response to 'Comment on 'Unexpected size effect in the thermopower of thin-film stripes'' J. Appl. Phys. 115, 236101 (2014)

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In the Comment, the authors present COMSOL simulations and argue that our observed phenomena in dual-beam thin film thermal sensors are not due to a size-dependent Seebeck effect as we claimed, but rather wire-size-dependent heat transport that causes unequal heating at the bonding pads, leading to a temperature difference ΔT_c = Tc_W - Tc_N, where Tc_W and Tc_N are the increased temperatures at the wide (W) and narrow (N) beams. Consequently, the observed voltage output ΔV indeed corresponds to a thermoelectric effect of a parasitic thermocouple formed between the metal structure and the bonding pad, i.e., ΔV = ΔS ΔTc, where ΔS is the difference in Seebeck coefficient of the sensor film to Al lead. And, ΔTc is mainly determined by Tc_W, because Tc_N is approaching the local substrate temperature when the sensor is long enough (Figs. 2 and 5 of the Comment).

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