首页> 美国政府科技报告 >Compressive Strength and Damage Mechanisms in Ceramic Materials. I. The Role of Subcritical Tensile Microfracture Processes in Compression Failure of Ceramics. II. Electron Channeling Study of Fracture in Alumina-Evidence for Crac

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Compressive Strength and Damage Mechanisms in Ceramic Materials. I. The Role of Subcritical Tensile Microfracture Processes in Compression Failure of Ceramics. II. Electron Channeling Study of Fracture in Alumina-Evidence for Crac

机译：陶瓷材料的抗压强度和损伤机理。 I.亚临界拉伸微裂缝过程在陶瓷压缩破坏中的作用。 II。氧化铝断裂的电子通道研究 - Crac的证据

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The compressive strength of SiC, Si3N4, and Al2O3 is investigated over wide ranges in temperature and loading rate. Several distinct damage regimes are identified, all based upon tensile microfracture processes. Two aspects of the work are of special interest. The first is the identification of a high strain rate regime in which material inertial effects are responsible for unusually rapid strengthening; the basis for the effect is increased difficulty in either crack nucleation or extension. Secondly, it is found that at low loading rates, subcritical tensile microcrack growth is responsible for a thermally activated strength dependence. Selected area electron channeling experiments lead to the conclusion that the thermal activation process may involve crack tip plasticity. (Author)

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Lankford, J.; Davidson, D. L.;
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年度 1981
页码 p.1-35
总页数 35
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Ceramic materials; Strength(Mechanics); Compressive properties; Silicon carbides; Silicon nitrides; Aluminum oxides; Thermal properties; Loads(Forces); Strain rate; Tensile properties; Crack propagation; Microcracking; Fracture(Mechanics); Plastic properties; Tempe;

机译：陶瓷材料;强度（力学）;压缩性能;碳化硅;氮化硅;氧化铝;热性能;载荷（力）;应变率;拉伸性能;裂纹扩展;微裂纹;断裂（力学）;塑性; Tempe;

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Compressive Strength and Damage Mechanisms in Ceramic Materials. I. The Role of Subcritical Tensile Microfracture Processes in Compression Failure of Ceramics. II. Electron Channeling Study of Fracture in Alumina-Evidence for Crac

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