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首页> 美国政府科技报告 >Effect of Solid-Solution W Addition on the Nanostructure of Electrodeposited Ni.
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Effect of Solid-Solution W Addition on the Nanostructure of Electrodeposited Ni.

机译：固溶体W加成对电沉积Ni纳米结构的影响。

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Electrodeposition method was employed to produce freestanding Ni-W alloy foils. The foils consist of nanograins. The structure of the foil, e.g. texture, grain morphology, size distribution, and the nature of grain boundaries, were characterized using X-ray diffraction and high-resolution electron microscopy. The deposited foils exhibit an equiaxed nanocrystalline structure having a grain size value of about 6 nm. Two types of grain boundary structure were observed. One type of grain boundary is essentially one atomic layer thin and another type consists of a structureless layer of about 0.5-1 nm in thickness. Angular dark field (Z-contrast) image of the deposited foils showed an inhomogeneous distribution of W solutes. In some local regions, the W content actually exceeds the equilibrium solid solution limit. Many grain boundaries with a structureless layer of about 0.5-1 nm are probably a result of local supersaturation of W.

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