首页> 美国政府科技报告 >Strain-Modulated Epitaxy: A Flexible Approach to 3-D Band Structure Engineering Without Surface Patterning.
【24h】

Strain-Modulated Epitaxy: A Flexible Approach to 3-D Band Structure Engineering Without Surface Patterning.

机译:应变调制外延:一种灵活的三维带结构工程方法,无需表面图案化。

获取原文

摘要

Thin compliant growth substrates have been used to reduce the strain in lattice-mismatched overlayers during epitaxial growth. This letter reports a new thin compliant substrate technology which allows these thin substrates to be patterned on the bottom, bonded surface. This lateral strain variation (inverted stressor) in the growing film can be combined with the additional effects of strain-dependent growth kinetics to realize the lateral control of composition and thickness without any surface topography on the substrate. Initial demonstrations of the growth of InGaAs on GaAs bottom-patterned thin substrates are presented herein.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号