Tensile and Shear Behavior of Alloyed SN-Pb Solder Joints.

机译：合金化sN-pb焊点的拉伸和剪切行为。

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This study presents an investigation of three ternary additions to a near-eutectic Sn-Pb alloy: indium (In), bismuth (Bi), and antimony (Sb). The effects of these ternary additions on the microstructure and on the strength in tensile and shear loading conditions in a joint configuration were studied. 17 refs., 29 figs. (ERA citation 13:051606)

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作者
Quan, L. K.;
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年度 1988
页码 1-54
总页数 54
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Lead Alloys; Tin Alloys; Microstructure; Soldered Joints; Antimony Additions; Bismuth Additions; Grain Boundaries; Indium Additions; Mechanical Properties; Microscopy; Phase Diagrams; Shear; Tensile Properties; ERDA/360103; Theses;

机译：铅合金;锡合金;微观结构;焊接接头;锑添加物;铋添加物;晶界;铟添加物;机械性能;显微镜;相图;剪切;拉伸性能; ERDa / 360103;论文;

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1. Influence of single-wall carbon nanotube addition on the microstractural and tensile properties of Sn-Pb solder alloy [J] . K. Mohan Kumar, V. Kripesh, Andrew A.O. Tay Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2008,第1a2期

机译：单壁碳纳米管的添加对Sn-Pb钎料合金显微组织和拉伸性能的影响
2. On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn-Pb Solder [J] . B. L. Boyce, L. N. Brewer, M. K. Neilsen, Journal of Electronic Packaging . 2011,第3期

机译：共晶锡铅焊料的应变率和温度相关的拉伸行为
3. Maximum shear stress-controlled uniaxial tensile deformation and fracture mechanisms and constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures [J] . Xiaoliang Ji, Qi An, Yiping Xia, Materials Science and Engineering . 2021,第Jula5期

机译：最大剪切应力控制的单轴拉伸变形和裂缝机制及裂缝机制在低温温度下SN-PB共晶合金的组成关系
4. High Temperature Behavior of Eutectic Sn-Pb and Sn-Ag Soldering Alloys [C] . J.M. Cabrera, J.A. Cubero, A. Subirats, Advanced Structural Materials Symposium of the Annual Congress of the Mexican Academy of Materials Science; Aug 26-31, 2002; Cancun Quintana Roo, Mexico . 2002

机译：共晶Sn-Pb和Sn-Ag焊接合金的高温行为
5. Creep behavior of solder joints under combined shear and tensile stresses. [D] . Allami, Melika. 2014

机译：组合剪切应力和拉伸应力下焊点的蠕变行为。
6. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint [O] . Sang-Yeob Lee, Jong-Hyuk Lee 2010

机译：焊接工艺和间隙距离对Ni-Cr合金焊接接头抗拉强度的影响
7. Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys [O] . J. P. Tucker, D. K. Chan, G. Subbarayan, 2012

机译：错误至：混合SN-PB / SN-3.0AG-0.5CU焊料合金的组成型行为
8. Isothermal Fatigue Behavior of Sn-Pb Solder Joints. [R] . Summers, T. S. E., Morris, J. W. 1989

机译：sn-pb焊点的等温疲劳行为。

Tensile and Shear Behavior of Alloyed SN-Pb Solder Joints.

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