Fatigue and Thermal Fatigue Testing of Pb-Sn Solder Joints

机译：pb-sn焊点的疲劳和热疲劳试验

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In an electronic package, materials of different thermal expansion coefficients are usually joined with Pb-Sn solder. The combination of temperature fluctuations and different thermal expansion coefficients creates a condition of thermal fatigue in the solder joints. This paper presents a discussion of experimental techniques developed to study fatigue in solder joints. Specimens have been developed to reproducibly test solder joints in shear using a modified double lap shear configuration. Tests were performed using a digital loadframe especially designed to isothermally fatigue solder joints in shear. Joints tested had a nominal solder composition of 60Sn-40Pb soldered to Cu. Failures were found to occur in the solder joint after fewer cycles at 125 deg C than at lower temperatures. Solder joints were also tested in shear thermal fatigue. A specimen design consisting of two materials with different thermal expansion coefficients constraining a solder joint was cycled between -55 deg C and 125 deg C. Results of these tests indicate that there is a coarsening of the solder near the joint interface and fatigue cracks initiate in these coarsened regions. (ERA citation 12:023242)

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Frear, D. ; Grivas, D. ; McCormack, M. ; Tribula, D. ; Morris, J. W.;
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年度 1987
页码 1-23
总页数 23
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Electronic Circuits; Soldered Joints; Thermal Fatigue; Copper; Failures; Fatigue; Lead Alloys; Shear; Thermal Cycling; Tin Alloys;

机译：电子电路;焊接接头;热疲劳;铜;失效;疲劳;铅合金;剪切;热循环;锡合金;

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专利

1. Influence of environment on the fatigue of Pb-Sn solder joints [J] . Guo Z., Sprecher A.F. IEEE Transactions on Components, Hybrids, and Manufacturing Technology . 1991,第4期

机译：环境对Pb-Sn焊点疲劳的影响
2. Solder joint accelerated test reliability requirements - a bad example: Specifying solder joint reliability requirements requires understanding of solder creep-fatigue behavior [J] . Werner Engelmaier Global SMT & Packaging: European Edition (Surface Mount Technology) . 2011,第4期

机译：焊点加速测试可靠性要求-一个不好的例子：指定焊点可靠性要求需要了解焊锡蠕变疲劳行为
3. Micro-mechanics of fatigue damage in Pb-Sn solder due to vibration and thermal cycling [J] . A. Dasgupta, P. Sharma, K. Upadhyayuka International Journal of Damage Mechanics . 2001,第2期

机译：振动和热循环导致Pb-Sn焊料疲劳破坏的微观机制
4. Computer modeling of isothermal low-cycle fatigue of Pb-Sn solder joints [C] . Zhenfeng Guo, Conrad, H. Electronic Components and Technology Conference, 1993. Proceedings., 43rd . 1993

机译：Pb-Sn焊点等温低周疲劳的计算机建模
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Attentional and visual demands for sprint performance in non-fatigued and fatigued conditions: reliability of a repeated sprint test [O] . Inge HF Reininga, Koen APM Lemmink, Ron L Diercks, 2010

机译：非疲劳和疲劳条件下对冲刺性能的注意和视觉要求：重复冲刺测试的可靠性
7. Thermal Fatigue Reliability and Mechanical Fatigue Reliability of Sn-Zn Solder Joints in Surface Mounting Process under Environmental Test [O] . Tomoya KIGA, Shinya HATTORI, Yuichi IWANABE 2003

机译：环境试验下表面安装过程中SN-ZN焊点的热疲劳可靠性和机械疲劳可靠性
8. Fatigue and Thermal Fatigue of Pb-Sn Solder Joints [R] . Frear, D. , Grivas, D. , McCormack, M. , 1987

机译：pb-sn焊点的疲劳与热疲劳

Fatigue and Thermal Fatigue Testing of Pb-Sn Solder Joints

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