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首页> 美国政府科技报告 >In Situ Investigation of Substrate Surface Recontamination During Glow Discharge Sputter Cleaning.
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In Situ Investigation of Substrate Surface Recontamination During Glow Discharge Sputter Cleaning.

机译：辉光放电溅射清洗过程中基板表面再污染的原位研究。

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摘要

In the applications of thin film technology,the chemical nature of the substrate surface is known to affect the film/substrate interactions. Undesirable contaminants in the interfacial region may affect film nucleation,adhesion and electrical or optical properties. Often,glow discharge sputter cleaning is used as a surface preparation technique prior to thin film deposition. Since this method of sputter cleaning is performed in a gaseous environment where the mean free path of the sputtered atoms is short,there is a possibility of surface recontamination by material sputtered from the substrate and from surrounding fixturing. In this investigation,we have used soft x-ray appearance potential spectroscopy to monitor,in situ,the substrate surface composition after sputter cleaning with both D. C. and R. F. discharges. Data are presented which show that common contaminants such as carbon and oxide layers may be adequately removed by either D. C. or R. F. glow discharge sputter cleaning. D. C. sputter cleaning was found to recontaminate the surface with materials sputtered from the substrate support and from nearby ground shielding. R. F. sputter cleaning,when performed at high bias levels (approximately 2kV) and at low gas pressures (greater than 10mu ),is capable of producing a surface free of added impurities.

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