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Fatigue Damage Accumulation in 63Sn-37Pb Solder Alloy

机译：63sn-37pb钎料合金的疲劳损伤累积

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This paper presents the application of a TMF damage model to assess reliabilityof a typical 63Sn-37Pb solder joint material. The damage model is introduced to quantify the fatigue damage accumulation in the solder alloy taking into account the presence of micro-defects as they initiate, coalesce, grow, and coarsen under TMF loading. The effect of damage on solder behavior is captured with a coupled viscoplastic damage constitutive model. The proposed model is applied to calculate the hysteresis loops of solder under applied strain rates 10(-3)/s, 10(-4)/s and 10(-5)/s at temperature 80degC. The model is also able to characterize the cyclic softening of solder that has been observed experimentally under fatigue loading. Based on the concept of equivalent damage accumulation, a failure criterion is proposed for the determination of fatigue life. It is shown that mechanical behavior and fatigue life of 63Sn-37Pb solder alloy can be satisfactorily predicted.

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