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D0 Silicon Upgrade: Thermal Conductivity Measurements of a Variety of Epoxies and Greases Used for CDF/D0 Silicon Detector Ladder Construction

机译:D0硅升级:用于CDF / D0硅探测器梯形结构的各种环氧树脂和润滑脂的热导率测量

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The bulk thermal conductivity of several epoxy mixtures was measured with a setup at Lab D. Samples are prepared by using two aluminum cylinders of 3/4-inch diameter. The cylinders have holes drilled in them for insertion of temperature sensors (0.040-inch diameter thermistors), a heating element (standard resistor), and a tapped hole for heat sinking to a plate. The two cylinders are held together during gluing, and the thickness of the glue bead is controlled by using a shim of kapton tape, nominally 3.5 mils thickness per ply of tape. A resistor is glued into the hole using 5 minute epoxy. Care is taken to avoid shorting the leads to the aluminum cylinder. Once the sample is prepared, the sample is fixed to the heat sink using the tapped hole provided. Thermistors are carefully inserted into the four holes. Once set up, the data acquisition program is run for a half-hour prior to turning on the heater power. This is done to ensure that all temperatures stabilize, and this is checked when doing the analysis. The power is then turned on and run until the temperatures have stabilized, which takes two additional hours. The data acquisition program outputs the four measured temperatures in the form of a voltage. which is read across the thermistor. With known temperatures, a known geometry, and known joint thickness, the temperature drop across the joint can be extrapolated and the bulk thermal conductivity of the interface material can be calculated. The power is measured directly using an ammeter in series with the power supply, and measuring the voltage across the resistor while powered up. The resistor value is measured using a hand held device in order to cross-correlate the measurements. The voltage and current are independently measured using the data acquisition program.

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