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Mode 1 delamination growth in adhesively bonded joints under static and fatigue loads

机译：模式1在静态和疲劳载荷下粘接接头的分层增长

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The objective of this investigation was to characterize the pure mode 1 delamination growth in metal to metal adhesively bonded joints under static and fatigue loading conditions, using FM 73 adhesive. Double cantilever beam specimens (DCB) were used for pure mode 1 tests. Aluminum 2024-T3 adherends were bonded with FM 73 adhesive. Delamination was introduced during fabrication by inserting a Teflon film between the two adherends. The mode 1 strain energy release rate G sub I sub c was obtained directly from static DCB tests conducted in accordance with the ASTM designation D1876-12. Constant amplitude fatigue tests on DCB specimens were conducted to determine the relationship between delamination growth rate da/dN and strain energy release rate G sub I sub c for a pure mode 1 delamination growth. It is found that the debond propagation rate in adhesive joints using FM 73 is more sensitive to errors in design load than is typical crack growth rate in metallic structures.

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