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TEMPERATURE RISE FOR SPRING-LOADED PHASE CHANGE DEVICES

机译:弹簧加载相变装置的温升

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SOLID-TO-LIQUID PHASE CHANGE MATERIALS (PCM) THAT MAY FIND USE ON PLANETARY PROBES ARE EXAMINED. IN THIS APPLICATION, THE PCM WILL PERFORM ONLY THROUGH THE MELTING CYCLE TO POSTPONE THE OVERHEATING OF EQUIPMENT WITHIN THE PROBE. ONE WAY TO MINIMIZE TEMPERATURE RISE IS TO MAINTAIN SOLID PHASE CONTACT MELTING. RESULTING FLOW CONDITIONS IN THE LIQUID PCM FILM AND TEMPERATURE RISE ACROSS THE FILM ARE DERIVED. THE SIGNIFICANCE OF THE RESULTING EQUATIONS, AND WAYS SUGGESTED BY THEM TO REDUCE TEMPERATURE RISE, ARE DISCUSSED. EXPERIMENTAL DATA AVAILABLE ARE COMPARED TO CALCULATED RESULTS.

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