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Parallel GAP Welding Kovar Ribbons to Copper Conductor Printed Wiring Boards

机译：并行Gap焊接可伐合金带到铜导体印刷线路板

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作者
Mc Daniel, G. E.;
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年度 1971
页码 1-3
总页数 3
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Copper ; Kovar (trademark) ; Printed circuits ; Welding ; Breadboard models ; Electrical resistivity ; Metal coatings ; Plating ; Quality control;

机译：铜; Kovar（商标）;印刷电路;焊接;面包板模型;电阻率;金属涂层;电镀;质量控制;

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专利

1. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压动态平行度对多层印刷线路板差异的影响-多层印刷线路板精密粘合技术的研究IV
2. Influence of dynamic parallelism of hot press on discrepancy of multilayer printed wiring boards - study on precise adhesion technology of multilayer printed wiring boards IV [J] . Hideyasu Murooka, Masayuki Kyooi, Hiroya Murakami, 塑性と加工 . 1997,第438期

机译：热压机动态平行性对多层印刷线板差异的影响 - 多层印刷配线板精确粘合技术研究IV
3. Impulse Withstand Voltage between Foil Conductors on Printed Wiring Board [J] . Yamano Y., Shutoh K. IEEE Transactions on Dielectrics and Electrical Insulation . 2008,第2期

机译：印刷线路板上箔导体之间的冲击耐受电压
4. Current carrying capacity of copper conductors in printed wiring boards [C] . Pan, T.-Y., Poulson, Electronic Components and Technology Conference, 1993. Proceedings., 43rd . 1993

机译：印刷线路板中铜导体的载流量
5. Thermal Stability of Nanocrystalline Copper for Potential Use in Printed Wiring Board Applications. [D] . Woo, Patrick Kai Fai. 2011

机译：印刷线路板应用中潜在使用的纳米晶铜的热稳定性。
6. Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi [O] . He Zhang, Shang Wang, Bingying Wu, 2021

机译：超快平行微隙电阻焊接AUNI
7. Surge Endurance between Foil Conductors across a Narrow Gap on Printed Wiring Board [O] . Yoshiaki Yamano, Katsuhiko Shutoh, Masaaki Kando, 2007

机译：印刷布线板上窄间隙的箔导体之间的浪涌耐久性
8. Parallel gap welding Kovar ribbons to copper conductor printed wiring boards [R] . Mc Daniel, G. E. 1971

机译：平行间隙焊接可伐合金带到铜导体印刷线路板

Parallel GAP Welding Kovar Ribbons to Copper Conductor Printed Wiring Boards

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