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首页> 外文OA文献 >Influence of Pin Length and Electrochemical Platings on the Mechanical Strength and Macroscopic Defect Formation in Stationary Shoulder Friction Stir Welding of Aluminium to Copper
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Influence of Pin Length and Electrochemical Platings on the Mechanical Strength and Macroscopic Defect Formation in Stationary Shoulder Friction Stir Welding of Aluminium to Copper

机译：销长和电化学夹板对铝固定肩部摩擦搅拌焊接的机械强度和宏观缺陷形成的影响

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摘要

The fabrication of dissimilar joints for electrical applications raises challenges for conventional joining technologies. Within solid-state processes, friction stir welding (FSW) provides numerous advantages to realize different joint configurations. However, depending on the intermixing of the materials, defects like hooking and significant intermetallic compound formation around copper fragments are observed and lead to a decrease in joint properties. Therefore, stationary shoulder FSW was applied to produce 2 mm EN AW1050/CW024A lap joints with minimized intermixing at the interface. Compared to conventional FSW, the range of the friction-based heat input can be increased without risking excessive plastification under the tool shoulder. The influence of the pin length on the interfacial structure as well as the mechanical properties were investigated. A pin length of 2.2 mm and hence a plunging of approximately 0.2 mm into the lower copper sheet was found to obtain the highest failure load. A further increase caused the formation of hooking defects, which led to void formation at the interface and failure within the area of the thinned aluminium sheet. The results were also transferred to lap joints with a tin and silver interlayer of 10 µm and also showed good results in terms of bond strength and contact area.
机译：用于电气应用的不同接合的制造引起了传统连接技术的挑战。在固态过程中，摩擦搅拌焊接（FSW）提供了实现不同的关节配置的许多优点。然而，根据材料的混合，观察到悬架和显着的金属间化合物形成的缺陷被观察到铜片段周围形成并导致接合性能降低。因此，施用静止肩部FSW以产生2mm en en 1050 / cw024a搭接接头，在界面处最小化混合。与传统的FSW相比，可以增加摩擦基热输入的范围，而不会在工具肩部下冒险过度塑化。研究了销长对界面结构的影响以及机械性能。销长度为2.2mm，因此发现发现较低铜板中的大约0.2mm的困扰以获得最高的故障载荷。进一步的增加导致钩挂缺陷的形成，其导致在界面处的界面形成，并且在变薄的铝板的面积内失效。结果也将其转移到Lap关节中，锡和银夹层为10μm，也显示出粘合强度和接触面积的良好结果。

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