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Influence of printed board surface finishing on solderability with vapour soldering

机译：印制板表面光洁度对气相钎焊可焊性的影响

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摘要

Práce se zabývá problematikou pájení v parách a smáčením povrchu pájkou při procesu pájení. Podrobněji popisuje výhody a nedostatky jednotlivých povrchových úprav pájecí ploch na DPS. Obecně charakterizuje vlastnosti bezolovnatých pájek a tavidel. Popisuje princip pájení v parách, včetně vlastností samotné kapaliny. Dále se zaměřuje na metodu vyhodnocování smáčivosti pomocí kuličky pájky a její provedení na jednotlivých vzorcích povrchových úprav.

机译：这项工作涉及在焊接过程中蒸汽焊接和用焊料润湿表面的问题。它更详细地描述了PCB上焊料表面的单独表面处理的优缺点。它通常表征无铅焊料和助焊剂的特性。描述了蒸汽焊接的原理，包括液体本身的特性。它还着重于使用焊球评估润湿性的方法及其在单个表面处理样品上的实现。

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Matras Jan;
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年度 2016
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原文格式 PDF
正文语种 cs
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专利

1. Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish [J] . Huang X., Lee S. W. R., Li M., IEEE transactions on electronics packaging manufacturing . 2008,第3期

机译：镍/金表面处理的印刷电路板晶圆级芯片级封装中的焊点金脆
2. Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints [J] . Wu PL, Huang MK, Lee C, Journal of the Chinese Institute of Chemical Engineers . 2004,第5期

机译：印刷电路板表面光洁度和热机械疲劳度对小轮廓J引线/ Sn-X（X = AgCu和Pb）焊点的组织和机械强度的影响
3. Investigating the Influence of Uneven Printed Wiring Board Surface on Volume Increment of Deposited Solder Pastes [J] . Oliver Krammer, Laszlo Milan Molnar, Laszlo Jakab, Micro and Nanosystems . 2010,第3期

机译：研究印刷电路板表面不均匀对沉积的焊膏体积增量的影响
4. Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish [C] . Arfaei Babak, Mutuku Francis, Sweatman Keith, IEEE Electronic Components and Technology Conference . 2014

机译：焊点可靠性取决于焊锡量，成分和印刷电路板表面光洁度
5. Impact of board pad finish on the tin-lead and lead-free solder interconnect reliability for leadless chip resistors under random vibration environment [D] . Plaza, Gustavo Alberto 2008

机译：随机振动环境下，无铅贴片电阻的电路板焊盘表面处理对锡铅和无铅焊料互连可靠性的影响
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Flatpack Soldering to Solder-Leveled Printed Wiring Boards [O] . 1973

机译：PLATPACK焊接到焊接电平的印刷线路板
8. Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance;Circuit World [R] . Vianco, P. T. 1998

机译：表面处理概述及其在印刷电路板可焊性和焊点性能中的作用;电路世界

Influence of printed board surface finishing on solderability with vapour soldering

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