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3D ToF-SIMS imaging of polymer multilayer films using argon cluster sputter depth profiling

机译：聚合物簇膜的3D ToF-SIMS成像，使用氩簇溅射深度分布

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ToF-SIMS imaging with argon cluster sputter depth profiling has provided detailed insight into the three-dimensional (3D) chemical composition of a series of polymer multilayer structures. Depths of more than 15 μm were profiled in these samples while maintaining uniform sputter rates. The 3D chemical images provide information regarding the structure of the multilayer systems that could be used to inform future systems manufacturing and development. This also includes measuring the layer homogeneity, thickness, and interface widths. The systems analyzed were spin-cast multilayers comprising alternating polystyrene (PS) and polyvinylpyrrolidone (PVP) layers. These included samples where the PVP and PS layer thickness values were kept constant throughout and samples where the layer thickness was varied as a function of depth in the multilayer. The depth profile data obtained was observed to be superior to that obtained for the same materials using alternative ion sources such as C60 n+. The data closely reflected the “as manufactured” sample specification, exhibiting good agreement with ellipsometry measurements of layer thickness, while also maintaining secondary ion intensities throughout the profiling regime. The unprecedented quality of the data allowed a detailed analysis of the chemical structure of these systems, revealing some minor imperfections within the polymer layers and demonstrating the enhanced capabilities of the argon cluster depth profiling technique.
机译：具有氩气簇溅射深度轮廓的ToF-SIMS成像提供了对一系列聚合物多层结构的三维（3D）化学成分的详细了解。在保持均匀溅射速率的同时，这些样品的深度超过15μm。 3D化学图像提供了有关多层系统结构的信息，这些信息可用于为将来的系统制造和开发提供信息。这还包括测量层的均匀性，厚度和界面宽度。所分析的系统是包括交替的聚苯乙烯（PS）和聚乙烯吡咯烷酮（PVP）层的旋铸多层。这些样品包括PVP和PS层厚度值始终保持恒定的样品，以及层厚度随多层厚度的变化而变化的样品。观察到获得的深度分布数据优于使用替代离子源（例如C60 n +）获得的相同材料的深度分布数据。数据紧密反映了“出厂时”的样品规格，与层厚度的椭圆偏光法测量结果具有很好的一致性，同时在整个分析过程中也保持了次级离子强度。前所未有的数据质量允许对这些系统的化学结构进行详细分析，揭示出聚合物层内的一些小缺陷，并证明了氩气团簇深度剖析技术的增强功能。

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