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ITO with embedded silver grids as transparent conductive electrodes for large area organic solar cells

机译:带有嵌入式银栅的ITO作为大面积有机太阳能电池的透明导电电极

摘要

In this work, development of semi-transparent electrodes for efficient large area organic solar cells (OSCs) has been demonstrated. Electron beam evaporated silver grids were embedded in commercially available ITO coatings on glass, through a standard negative photolithography process, in order to improve the conductivity of planar ITO substrates. The fabricated electrodes with embedded line and square patterned Ag grids reduced the sheet resistance of ITO by 25 % and 40 %, respectively, showing optical transmittance drops of less than 6 % within the complete visible light spectrum for both patterns. Solution processed bulk heterojunction OSCs based on PTB7:[70]PCBM were fabricated on top of these electrodes with cell areas of 4.38 cm2, and the performance of these OSCs was compared to reference cells fabricated on pure ITO electrodes. The Fill Factor of the large-scale OSCs fabricated on ITO with embedded Ag grids was enhanced by 18 % for the line grids pattern and 30 % for the square grids pattern compared to that of the reference OSCs. The increase in the Fill Factor was directly correlated to the decrease in the series resistance of the OSCs. The maximum power conversion efficiency (PCE) of the OSCs was measured to be 4.34 %, which is 23 % higher than the PCE of the reference OSCs. As the presented method does not involve high temperature processing, it could be considered a general approach for development of large area organic electronics on solvent resistant, flexible substrates.
机译:在这项工作中,已经证明了开发用于有效的大面积有机太阳能电池(OSC)的半透明电极。通过标准负性光刻工艺,将电子束蒸发的银栅格嵌入在玻璃上的市售ITO涂层中,以提高平面ITO基板的电导率。带有嵌入的线状和正方形图案化的Ag网格的已制成电极分别将ITO的薄层电阻降低了25%和40%,在两种图案的完整可见光谱范围内,其光透射率下降均小于6%。在这些电极的顶部制造了基于PTB7:[70] PCBM的溶液处理的本体异质结OSC,其电池面积为4.38 cm2,并将这些OSC的性能与在纯ITO电极上制造的参考电池进行了比较。与参考OSC相比,在带有嵌入式Ag网格的ITO上制造的大型OSC的填充因子对于线栅图案提高了18%,对于正方形网格图案提高了30%。填充因子的增加与OSC串联电阻的减少直接相关。经测量,OSC的最大功率转换效率(PCE)为4.34%,比参考OSC的PCE高23%。由于提出的方法不涉及高温处理,因此可以认为是在耐溶剂的柔性基板上开发大面积有机电子器件的通用方法。

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