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Surface modification by metal ion implantation forming metallic nanoparticles in insulating matrix.

机译:通过金属离子注入进行的表面改性在绝缘基质中形成金属纳米颗粒。

摘要

There is special interest in the incorporation of metallic nanoparticles in a surrounding dielectric matrix for obtaining composites with desirable characteristics such as for surface plasmon resonance, which can be used in photonics and sensing, and controlled surface electrical conductivity. We investigated nanocomposites produced through metallic ion implantation in insulating substrate, where the implanted metal self-assembles into nanoparticles. During the implantation, the excess of metal atom concentration above the solubility limit leads to nucleation and growth of metal nanoparticles, driven by the temperature and temperature gradients within the implanted sample including the beam-induced thermal characteristics. The nanoparticles nucleate near the maximum of the implantation depth profile (projected range), that can be estimated by computer simulation using the TRIDYN. This is a Monte Carlo simulation program based on the TRIM (Transport and Range of Ions in Matter) code that takes into account compositional changes in the substrate due to two factors: previously implanted dopant atoms, and sputtering of the substrate surface. Our study suggests that the nanoparticles form a bidimentional array buried few nanometers below the substrate surface. More specifically we have studied Au/PMMA (polymethylmethacrylate), Pt/PMMA, Ti/alumina and Au/alumina systems. Transmission electron microscopy of the implanted samples showed the metallic nanoparticles formed in the insulating matrix. The nanocomposites were characterized by measuring the resistivity of the composite layer as function of the dose implanted. These experimental results were compared with a model based on percolation theory, in which electron transport through the composite is explained by conduction through a random resistor network formed by the metallic nanoparticles. Excellent agreement was found between the experimental results and the predictions of the theory. It was possible to conclude, in all cases, that the conductivity process is due only to percolation (when the conducting elements are in geometric contact) and that the contribution from tunneling conduction is negligible.
机译:将金属纳米颗粒掺入周围的介电基质中以获得具有所需特性的复合材料,例如表面等离振子共振,可以用于光子学和传感,以及可控制的表面电导率,这是特别令人感兴趣的。我们研究了通过在绝缘基板中注入金属离子而产生的纳米复合材料,其中植入的金属自组装成纳米颗粒。在植入过程中,超过溶解度极限的过量金属原子浓度会导致金属纳米颗粒的形核和生长,这是由植入样品内的温度和温度梯度(包括束诱导的热特性)驱动的。纳米颗粒在接近注入深度分布的最大值(投影范围)附近成核,这可以通过使用TRIDYN的计算机模拟来估计。这是一个基于TRIM(物质中离子的传输和范围)代码的蒙特卡罗模拟程序,该程序考虑了由于以下两个因素而导致的基材成分变化:先前注入的掺杂原子和基材表面的溅射。我们的研究表明,纳米颗粒形成了埋在基板表面下方几纳米处的双向阵列。更具体地说,我们研究了Au / PMMA(聚甲基丙烯酸甲酯),Pt / PMMA,Ti /氧化铝和Au /氧化铝体系。植入样品的透射电子显微镜显示在绝缘基质中形成了金属纳米颗粒。通过测量复合层的电阻率作为注入剂量的函数来表征纳米复合材料。将这些实验结果与基于渗流理论的模型进行了比较,在模型中,通过复合材料的电子传输通过金属纳米颗粒形成的随机电阻网络的传导来解释。实验结果与理论预测之间找到了极好的一致性。在所有情况下都可以得出结论,电导率过程仅是由于渗流(当导电元件处于几何接触时)引起的,而隧穿传导的贡献可忽略不计。

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