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PROCÉDÉ DE FORMATION DE CUIVRE ÉLECTRODÉPOSÉ SUR LA SURFACE D'UN MATÉRIAU NON-MÉTALLIQUE PAR JET D' ENCRE À BASE DE GRAPHÈNE
PROCÉDÉ DE FORMATION DE CUIVRE ÉLECTRODÉPOSÉ SUR LA SURFACE D'UN MATÉRIAU NON-MÉTALLIQUE PAR JET D' ENCRE À BASE DE GRAPHÈNE
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摘要
A method for forming electroplated copper on a surface of non-metal materials by graphene-based plating ink is revealed. A graphene-based plating ink is prepared by modified functionalized graphene and then sprayed on a surface of a non-metal material. Next dry the graphene-based plating ink sprayed on the non-metal material. A layer of electroplated copper is formed on a surface of the graphene-based plating ink by plating. The method uses graphene-based plating ink as a conductor of the electroplated copper and increases adhesion between functionalized graphene contained in the graphene-based plating ink and the non-metal material by modification. During plating, no heavy metal is used as catalyst so that the method is environmentally friendly and cost-saving. The graphene-based plating ink with excellent adhesion and higher flexibility can be attached to the surface of the non-metal material firmly and used as an adhesive between electroplated copper and the non-metal material.
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