Device for removing wire from a wire package

• 1. 扁平电线用包覆材料、被扁平电线用包覆材料包覆的扁平电线、以及使用其的电气设备 [P] . 中国专利： CN102812526A . 2012-12-05
• 2. 具有电线剥皮和包覆功能的间接火线用自动开闭剥皮机以及使用它的间接火线电线剥皮方法和间接火线电线包覆方法 [P] . 中国专利： CN113474959A . 2021-10-01
• 3. SEMICONDUCTOR PACKAGE AND A METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE CAPABLE OF REMOVING A WIRE SHORT OR A WIRE OPEN PHENOMENON [P] . 韩国专利： KR20130078961A . 2013-07-10

  机译： 半导体封装和包装能够消除导线短路或导线开路现象的半导体器件的方法

• 4. Snow removing device for electric wire, manufacturing method of snow removing device for electric wire and snow removing method of electric wire [P] . 日本专利： JP6399295B2 . 2018-10-03

  机译： 电线除雪装置，电线除雪装置的制造方法和电线除雪方法

• 5. Device for removing coil wire and removing device of coil wire to remove a wire wrapped in a coil [P] . BR9500635A . 1996-01-23

  机译： 用于去除线圈线的装置和用于去除缠绕在线圈中的线的线圈线的去除装置

• 1. Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging [J] . LI Jun-hui, HAN Lei, ZHONG Jue 中南大学学报（英文版） . 2008,第005期
• 2. Research on Detection Device for Broken Wires of Coal Mine-Hoist Cable [J] . WANG Hong-yao, HUA Gang, TIAN Jie 矿业科学技术（英文版） . 2007,第003期
• 3. Research on Detection Device for Broken Wires of Coal Mine-Hoist Cable [J] . WANG Hong-yao, HUA Gang, TIAN Jie 中国矿业大学学报：英文版 . 2007,第003期
• 4. Wire-in-Wire TiO_(2)/C Nanofibers Free-Standing Anodes for Li-Ion and K-Ion Batteries with Long Cycling Stability and High Capacity [J] . Die Su, Yi Pei, Li Liu, 纳微快报：英文版 . 2021,第007期
• 5. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part I: analysis of a BGA package having gold wires with uniform dimensions [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2000,第1期
• 6. A practical method for predicting gold-wire deformation in transfer molding process of semiconductor devices. Part I: analysis of a BGA package having gold wires with uniform dimensions [J] . Saeki Junichi, Yoshida Isamu, Houzouji Hiroshi 成形加工: プラスチツク成形加工学会志 . 2000,第1期
• 7. Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages [J] . Hong T. H., Beleran J., Drake K. Y. S., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第12期
• 8. Bond-wire engineering to improve power performance in multi-cell GaN package devices [C] . Halder Subrata, McMacken John, Runton Dave IEEE MTT-S International Microwave Symposium . 2013
• 9. A comparison between deterministic and probabilistic thermal fatigue modeling of wires and wire bonds in microelectronic packages. [D] . Mortin, David Edward. 1999
• 10. Broken Wires Dropped Devices Stuck Stents Lost Coils and rings! Surgery for device related complications of PCI [O] . Jayakrishnan A Gosalakkal, Suraj Chavan 2015
• 11. A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices. Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions. [O] . Junichi Saeki, Isamu Yoshida, Hiroshi Houzouji 2000
• 12. Standard Engineering Installation Package. Secure Facsimile (AUTOVON) 2-Wire and 4-Wire. [R] . 1979

• 1. A Principle of Producing Multi-ply Paper Using a Wire in an Inclined Wire Machine [J] . Song-II Pak ,Yong-II Ri ,Chol-Ho Kim . 国际造纸 . 2019,第001期
• 2. 适用于配电线路无通道保护的备用电源自动投入装置 [C] . 刘琨 ,董新洲 ,薄志谦 . 第四届配电自动化新技术及其应用高峰论坛 . 2013
• 3. 可调式过电压保护装置在配电线路防雷中的应用 [A] . 许衡 . 2013