A method of manufacturing a TiO 2 /Cu composite composite film having near zero TCR and high bonding strength through aerosol deposition is disclosed. Room-temperature processing of TiO 2 /Cu composite films for embedded passive devices was attempted through an aerosol deposition process. Since the initial TiO 2 Effect of particle size in the densified (densification) of the internal microstructure of the TiO 2 / Cu composite film by means of XRD analysis and the observation of the internal microstructure, 500 nm- size TiO 2 compared to 25 nm- size TiO 2 It was shown that the TiO 2 /Cu composite film using was stronger bonding between particles. Then, in order to optimize the bonding strength and resistance temperature coefficient (TCR), the electrical and mechanical properties of TiO 2 (500 nm)/Cu composite films with different contents of TiO 2 were evaluated for application as advanced composite film resistance. . As a result, TiO 2 / Cu (50 wt % / 50 wt%) composite film is sufficient degree (electrical resistivity) electrical resistance goes from a suitable co-existence of the anchoring bond and mechanical interlock to be formed during the aerosol deposition (5.8x10 -3 Ωcm) , Excellent near-zero TCR (-3ppm/°C), and improved adhesive strength (~7.37N/mm 2 ).
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