首页> 外国专利> Multi-Band Millimeter-Wave (MMW) Antenna Array and Radio-Frequency Integrated Circuit (RFIC) Module

Multi-Band Millimeter-Wave (MMW) Antenna Array and Radio-Frequency Integrated Circuit (RFIC) Module

机译:多频带毫米波(MMW)天线阵列和射频集成电路(RFIC)模块

摘要

An apparatus is disclosed for a multi-band millimeter-wave (mmW) antenna array and radio-frequency integrated circuit (RFIC) module. In an example aspect, the apparatus includes a multi-band mmW antenna array and RFIC module with a first antenna array, a second antenna array, and at least one radio-frequency front-end integrated circuit. The first antenna array includes at least two first antenna elements and is tuned to a first mmW frequency band. The second antenna array includes at least two second antenna elements and is tuned to a second mmW frequency band. The at least one radio-frequency front-end integrated circuit includes at least two first transceiver chains and at least two second transceiver chains. The at least two first transceiver chains are respectively coupled to the at least two first antenna elements, and the at least two second transceiver chains are respectively coupled to the at least two second antenna elements.
机译:公开了一种用于多频带毫米波(mmW)天线阵列和射频集成电路(RFIC)模块的设备。在示例方面,该装置包括多频带mmW天线阵列和具有第一天线阵列,第二天线阵列和至少一个射频前端集成电路的RFIC模块。第一天线阵列包括至少两个第一天线元件,并且被调谐到第一mmW频带。第二天线阵列包括至少两个第二天线元件,并且被调谐到第二mmW频带。至少一个射频前端集成电路包括至少两个第一收发器链和至少两个第二收发器链。至少两个第一收发器链分别耦合到至少两个第一天线元件,并且至少两个第二收发器链分别耦合到至少两个第二天线元件。

著录项

  • 公开/公告号US2020144733A1

    专利类型

  • 公开/公告日2020-05-07

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号US201816178189

  • 申请日2018-11-01

  • 分类号H01Q21/30;H01Q1/24;H01Q1/40;H01Q21/24;H01Q5/50;H01Q1/22;H01Q5/28;H01Q5/35;

  • 国家 US

  • 入库时间 2022-08-21 11:19:25

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