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Cu-Co-Si-BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND COMPONENT USING THE SHEET MATERIAL
Cu-Co-Si-BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME, AND COMPONENT USING THE SHEET MATERIAL
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机译:Cu-Co-Si基铜合金薄板材料及其制造方法和使用该薄板材料的组件
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摘要
A copper alloy sheet material has a composition containing from 0.20 to 6.00% in total of Ni and Co, from 0 to 3.00% of Ni, from 0.20 to 4.00% of Co, and from 0.10 to 1.50% of Si, all in mass %, one or more of Fe, Mg, Zn, Mn, B, P, Cr, Al, Zr, Ti, Sn contained appropriately depending on necessity, the balance of Cu and unavoidable impurities, and has on a polished sheet surface thereof, a ratio SB/SC of 2.0 or more and an area ratio of SB occupied on the surface of 5.0% or more, wherein SB represents an area of a region having a crystal orientation difference from a Brass orientation {011} 211 measured by EBSD (electron backscattered diffraction) of 10° or less, and SC represents an area of a region having a crystal orientation difference from a Cube orientation {001} 100 of 10° or less.
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机译:铜合金片材的组成以质量%计含有总计0.20〜6.00%的Ni和Co,0〜3.00%的Ni,0.20〜4.00%的Co,0.10〜1.50%的Si。 Fe,Mg,Zn,Mn,B,P,Cr,Al,Zr,Ti,Sn中的一种或多种根据需要,Cu和不可避免的杂质的余量适当地包含,并且在其抛光的片材表面上具有S B Sub> / S C Sub>的比率大于或等于2.0,且表面上的S B Sub>的面积比大于或等于5.0%,其中S B Sub>表示通过EBSD(电子背散射衍射)测量的与黄铜取向{011} <211>的晶体取向差为10°以下且S C < / Sub>表示与立方取向{001} <100>的晶体取向差为10°或更小的区域的面积。
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