SEMICONDUCTOR PACKAGE WITH SEALED THERMAL INTERFACE CAVITY WITH LOW THERMAL RESISTANCE LIQUID THERMAL INTERFACE MATERIAL

• 1. 具有低热阻的高性能热界面材料 [P] . 中国专利： CN112080258A . 2020-12-15
• 2. 具有低热阻的高性能热界面材料 [P] . 中国专利： CN107250317A . 2017-10-13
• 3. Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials [P] . 美国专利： US6974723B2 . 2005-12-13

  机译： 包含低熔点填料的凝胶热界面材料和包含这些凝胶热界面材料的电子封装

• 4. Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials [P] . 美国专利： US6841867B2 . 2005-01-11

  机译： 包含低熔点填料的凝胶热界面材料和包含这些凝胶热界面材料的电子封装

• 5. Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials [P] . 美国专利： US2005040507A1 . 2005-02-24

  机译： 包含低熔点填料的凝胶热界面材料和包含这些凝胶热界面材料的电子封装

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