首页> 外国专利> HALFWAY CUTTER CHANGING METHOD FOR LARGE-AREA MICROSTRUCTURE CUTTING BASED ON IN-SITUATION FILM THICKNESS MEASUREMENT

HALFWAY CUTTER CHANGING METHOD FOR LARGE-AREA MICROSTRUCTURE CUTTING BASED ON IN-SITUATION FILM THICKNESS MEASUREMENT

机译:基于原位膜厚测量的大面积显微组织切割的半切线方法

摘要

The present invention demonstrates a halfway cutter changing method for large-area microstructure cutting based on in-situation film thickness measurement, including the following steps: step 110: preparatory work; step 120: workpiece preliminary machining; step 130: transparent film coating; step 140: film thickness detection; step 150: halfway cutter changing; and step 160: machining completion. The halfway cutter changing method for the large-area microstructure cutting based on the in-situation film thickness measurement provided by the present invention implements machining of a microstructure with large area, high quality and high uniformity.
机译:本发明展示了一种基于原位膜厚测量的大面积显微组织切割中途刀具更换方法,包括以下步骤:步骤 110 :准备工作;步骤 120 :工件预加工;步骤 130 :透明薄膜涂层;步骤 140 :膜厚检测;步骤 150 :中途切刀更换;步骤 160 :加工完成。本发明提供的基于原位膜厚测量的大面积微结构切割中途刀具更换方法,实现了大面积,高质量,高均匀度的微结构加工。

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