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Methods to form reduced form factor radio frequency system-in-package
Methods to form reduced form factor radio frequency system-in-package
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机译:形成减小外形尺寸的射频系统级封装的方法
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摘要
Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.
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