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Methods to form reduced form factor radio frequency system-in-package

机译:形成减小外形尺寸的射频系统级封装的方法

摘要

Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.
机译:形成堆叠电路组件的方法包括:将第一无线设备组件安装到基板的第一表面上,以及将第二无线设备组件放置在第一无线设备组件上,以使第一无线设备组件位于第二无线设备组件和第二无线设备组件之间。衬底的第一表面,使得第二无线设备组件的第一伸出部分延伸超过第一无线设备组件的外围。第一无线设备组件与第二无线设备组件通信,并且第二无线设备组件与基板通信。

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