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Systems and methods for performing microstructure simulation and implementation of additive manufacturing processes

机译：用于执行微观结构模拟和增材制造过程的实施的系统和方法

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摘要

Systems and methods are provided for receiving, by a simulation model, a thermal gradient and a cooling rate associated with a 3D printing material as inputs for the simulation model. The systems and methods further include generating, by the simulation model executed by a processing system, characteristics associated with the 3D printing material as outputs of the simulation model based on the thermal gradient and the cooling rate associated with the 3D printing material.

机译：提供了用于通过仿真模型接收与3D打印材料相关联的热梯度和冷却速率作为仿真模型的输入的系统和方法。该系统和方法还包括：基于处理系统执行的仿真模型，基于与3D打印材料相关的热梯度和冷却速率，生成与3D打印材料相关的特性作为仿真模型的输出。

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公开/公告号US10786849B2

专利类型
公开/公告日2020-09-29

原文格式PDF
申请/专利权人 ANSYS INC.;
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申请/专利号US201916294718
发明设计人 JAVED AKRAM;
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申请日2019-03-06
分类号B22F3/10;B22F3/105;B22F1;G06F17/50;G06F30/23;B33Y70;B33Y10;B33Y30;B33Y50/02;
国家 US
入库时间 2022-08-21 11:29:50

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