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Copper-containing particles, conductor-forming composition, method for producing conductor, conductor and device

机译:含铜颗粒,形成导体的组合物,制造导体的方法,导体和装置

摘要

PROBLEM TO BE SOLVED: To provide a copper-containing particle that enables excellent formation of a conductor at a low temperature, a conductor forming composition comprising the copper-containing particle, a method for producing a conductor which can be performed at a low temperature, a conductor which can be produced at a low temperature, and a device comprising the conductor.SOLUTION: A copper-containing particle has a core particle comprising copper, and organic matter present in at least part of the surface of the core particle, where a percentage of copper-containing particles with a major axis length of 50 nm or less is 80% or less.SELECTED DRAWING: None
机译:解决的问题:为了提供能够在低温下优异地形成导体的含铜颗粒,包含该含铜颗粒的导体形成用组合物,一种可以在低温下进行的导体的制造方法,解决方案:含铜粒子的核心粒子包含铜和至少存在于该核心粒子表面的有机物,其中主轴长度为50 nm以下的含铜颗粒的百分比为80%以下。

著录项

  • 公开/公告号JP6627228B2

    专利类型

  • 公开/公告日2020-01-08

    原文格式PDF

  • 申请/专利权人 日立化成株式会社;

    申请/专利号JP20150038205

  • 发明设计人 浦島 航介;米倉 元気;神代 恭;

    申请日2015-02-27

  • 分类号B22F1;H01B5;H01B1/22;H01B1;H01B13;H01B5/14;B22F9;B22F9/24;

  • 国家 JP

  • 入库时间 2022-08-21 11:32:15

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