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CHIP ASSEMBLY FOR MEASURING ELECTROCHEMICAL REACTION ON SOLID-LIQUID PHASE INTERFACE IN SITU

机译:用于现场测量固相界面上电化学反应的芯片组件

摘要

A chip assembly for measuring an electrochemical reaction on a solid-liquid phase interface in situ, comprising a first electrode (310), a second electrode (320), a first insulating film (510), a second insulating film (520), a third insulating film (530), a fourth insulating film (540) and an upper chip (100) and a lower chip (200) which are oppositely arranged and of which two sides are correspondingly combined in a sealing manner; a through hole (110) is provided on the upper chip (100); the first insulating film (510) under the through hole (110) is provided with the first electrode (310); a groove (210) opposite to the through hole (110) is provided on the lower chip (200); and the fourth insulating film (540) arranged at one side of the groove (210) is provided with the second electrode (320). The chip assembly dispenses with a specially-made sample rod, thereby substantially reducing test cost; and meanwhile, a lattice structure of a first electrode is also beneficial for observing topography change of a to-be-tested sample.
机译:一种用于在固液相界面上原位测量电化学反应的芯片组件,其包括第一电极(310),第二电极(320),第一绝缘膜(510),第二绝缘膜(520),相对配置的第三绝缘膜530,第四绝缘膜540,上芯片100和下芯片200以密封的方式相对应地结合在一起。在上芯片(100)上设有通孔(110)。在贯通孔(110)的下方的第一绝缘膜(510)上设有第一电极(310)。在下芯片(200)上设有与通孔(110)相对的槽(210)。设置在槽210的一侧的第四绝缘膜540具有第二电极320。芯片组件省去了特制的样品杆,从而大大降低了测试成本;同时,第一电极的晶格结构也有利于观察待测样品的形貌变化。

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