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Metal ceramic substrate and electrical or electronic circuitry or circuitry modules
Metal ceramic substrate and electrical or electronic circuitry or circuitry modules
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机译：金属陶瓷基板和电气或电子电路或电路模块
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摘要
Metal ceramic substrate, preferably in the form of a printed circuit board, for electrical or electronic circuits and circuitry modules comprising at least one ceramic layer (2) with a first and second surfaces (2a, 2b),which is metallised on at least one of the surfaces (2a, 2b) (3, 4), containing aluminium oxide, zirconium dioxide and yttrium oxide, forming the ceramic layer (2), The total weight of zirconium dioxide and yttrium oxide in the ceramic layer (2) are as follows:zirconium dioxide between 2 and 15 percentage by weight;Yttrium oxide between 0,01 and 1 percentage by weight; andAluminium oxide between 84 and 97 percentage by weight, the average grain size of the aluminium oxide used being between 2 and 8 micrometers.
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