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Semiconductor bridge circuit and method of making a semiconductor bridge circuit
Semiconductor bridge circuit and method of making a semiconductor bridge circuit
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机译：半导体桥电路和制造半导体桥电路的方法
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摘要
A half-bridge circuit (400) comprising: a first carrier (401_1), a second carrier (401_2), and a third carrier (401_3); a first power semiconductor chip (402_1) comprising a first major surface and a second major surface opposite the first major surface a source electrode is disposed on the first main surface and the first power semiconductor chip (402_1) is mounted on the first carrier (401_1) such that the second main surface faces the first carrier (401_1) and a drain electrode with the first carrier (401_1) 401_1); a second power semiconductor chip (402_2) comprising a first major surface and a second major surface opposite the first major surface, wherein a source electrode is disposed on the first major surface and the second power semiconductor chip (402_2) is disposed on the second carrier (401_2) that the second main surface faces the second carrier (401_2); terchip (402_3) on the third carrier (401_3) controlling the power semiconductor chips (402_1, 402_2); a contact clip (450) coupled to the first carrier (401_1) and the source of the second power semiconductor chip (402_2) and the drain electrode of the first power semiconductor chip (402_1) electrically connects to the source electrode of the second power semiconductor chip (402_2); an encapsulation body (404) in which the semiconductor chips (402_1, 402_2, 402_3) are embedded; a contact clip formed as an integral part (203), wherein the contact clip (203) comprises: a bonding portion (203_1) bonded to the source electrode of the first power semiconductor chip (402_1); a first portion (203_3) having a first side edge of the contact clip (203) and an external terminal of the half-bridge circuit (400), wherein the external terminal is exposed on the encapsulation body (404); a second portion (233_3) which is one of The second section (233_3) is connected via a bonding layer (461) to an outer connection element (460) configured separately from the supports (401_1, 401_2, 401_3), wherein the second lateral edge of the contact clip () 203) is embedded in the encapsulation body (404) and the outer terminal member (460) is exposed on the encapsulation body; the first lateral edge and the second lateral edge disposed at different heights relative to a lower-side plane of the substrates (401_1, 401_2, 401_3) are.
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