首页> 外国专利> FILM-FORMING DEVICE METHOD FOR MEASURING FILM THICKNESS OF ORGANIC FILM AND FILM THICKNESS SENSOR FOR ORGANIC FILM

FILM-FORMING DEVICE METHOD FOR MEASURING FILM THICKNESS OF ORGANIC FILM AND FILM THICKNESS SENSOR FOR ORGANIC FILM

机译:用于测量有机膜的膜厚的成膜装置方法和用于有机膜的膜厚传感器

摘要

[PROBLEMS] To provide a film forming apparatus capable of performing film formation rate control and film thickness measurement of an organic film with high accuracy, a method for measuring film thickness of an organic film, and a film thickness sensor for organic film. Solution The film forming apparatus 10 includes a vacuum chamber 11, an organic material source 12, a substrate holder 13, a film thickness sensor 14, and a measurement unit 17. The organic material source 12 is disposed inside the vacuum chamber 11 and is configured to be capable of emitting organic material particles. The substrate holder 13 is disposed to face the organic material source 12 and is configured to be able to hold the substrate W. As shown in FIG. The film sensor 14 is disposed inside the vacuum chamber 11 and has a crystal oscillator having a fundamental frequency of 4 MHz or less. The measuring unit 17 measures the film thickness of the organic film deposited on the substrate W on the substrate holder 13 based on the change in the resonance frequency of the crystal oscillator.
机译:[问题]提供一种能够高精度地进行有机膜的成膜速度控制及膜厚测定的成膜装置,有机膜的膜厚的测定方法以及有机膜的膜厚传感器。解决方案膜形成装置10包括真空室11,有机材料源12,基板支架13,膜厚度传感器14和测量单元17。有机材料源12设置在真空室11内部并被配置。能够发射有机材料颗粒。基板保持件13被布置成面对有机材料源12,并且被构造成能够保持基板W。膜传感器14设置在真空室11的内部,并具有基本频率为4MHz以下的晶体振荡器。测量单元17基于晶体振荡器的谐振频率的变化来测量沉积在基板保持器13上的基板W上的有机膜的膜厚。

著录项

  • 公开/公告号KR102035146B1

    专利类型

  • 公开/公告日2019-10-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20167026478

  • 申请日2015-05-22

  • 分类号C23C14/54;C23C14/12;C23C14/24;C23C14/50;G01B7/06;H01L51;H01L51/56;H05B33/10;

  • 国家 KR

  • 入库时间 2022-08-21 11:47:32

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