首页> 外国专利> OLED SELECTIVE FORMING METHOD FOR THIN FILM BY SOLUTION PROCESS OF ORGANIC SEMICONDUCTOR DEVICE ANTI-FORMING FILM USED FOR THE METHOD AND MANUFACTURING METHOD FOR OLED LIGHT BY SOLUTION PROCESS

OLED SELECTIVE FORMING METHOD FOR THIN FILM BY SOLUTION PROCESS OF ORGANIC SEMICONDUCTOR DEVICE ANTI-FORMING FILM USED FOR THE METHOD AND MANUFACTURING METHOD FOR OLED LIGHT BY SOLUTION PROCESS

机译:通过有机半导体器件溶液法制备薄膜的OLED选择性成膜方法及用于通过溶液法制备OLED光的方法和制造方法

摘要

The present invention relates to a method for selectively forming a thin film only in a part required in a process of manufacturing an organic semiconductor device by a solution process, which comprises the steps of: placing an anti-coating film on a part where a thin film is not formed; coating the entire surface including an upper side of the anti-coating film with a solution; curing the solution to form the thin film; and removing the anti-coating film to remain the thin film only on a remaining part. The anti-coating film is made of polydimethylsiloxane (PDMS) which is not applied with an adhesive. In order to selectively form a thin film only on a required part, an adhesive is not used but an anti-coating film made of PDMS in which the surface energy is adjusted, thereby applying a solution process without a problem of remaining the adhesive or pollutants attached to the adhesive and a problem occurring in a laser scribing process. Also, the large-area OLED illumination can be manufactured by a solution process so manufacturing costs thereof are greatly reduced, thereby commercializing the OLED illumination having excellent energy efficiency.
机译:本发明涉及仅在通过溶液法制造有机半导体器件的过程中需要的部分中选择性地形成薄膜的方法,该方法包括以下步骤:在薄的部分上放置防涂膜。未成膜;用溶液涂覆包括防涂膜的上侧的整个表面。使溶液固化以形成薄膜;除去抗涂膜以仅在剩余部分上保留薄膜。防涂膜由未涂胶的聚二甲基硅氧烷(PDMS)制成。为了仅在所需部分上选择性地形成薄膜,不使用粘合剂,而是使用由PDMS制成的防涂膜,在该涂膜中调节了表面能,从而进行了固溶处理,而没有残留粘合剂或污染物的问题。附着在粘合剂上,在激光划片过程中会出现问题。另外,可以通过溶液法制造大面积的OLED照明,因此大大降低了其制造成本,从而使具有优异能量效率的OLED照明商业化。

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