ADDITIVE PHOTONIC INTERCONNECTS IN MICROELECTRONIC DEVICE

• 1. 微电子设备中堆叠管芯的互连结构 [P] . 中国专利： CN110114874A . 2019-08-09
• 2. 微电子封装和冷却微电子封装中的互连特征的方法 [P] . 中国专利： CN101399240B . 2012.06.27
• 3. ADDITIVE PHOTONIC INTERCONNECTS IN MICROELECTRONIC DEVICE [P] . 美国专利： US2019204505A1 . 2019-07-04

  机译： 微电子设备中的附加光子互连

• 4. Microelectronic devices and methods for forming interconnects in microelectronic devices [P] . 美国专利： US7829976B2 . 2010-11-09

  机译： 微电子器件和在微电子器件中形成互连的方法

• 5. Microelectronic devices and methods for forming interconnects in microelectronic devices [P] . 美国专利： US7531453B2 . 2009-05-12

  机译： 微电子器件和在微电子器件中形成互连的方法

• 1. Device Physics Research for Submicron and Deep Submicron Space Microelectronics Devices and Integrated Circuits [J] . 系统工程与电子技术：英文版 . 1992,第004期
• 2. A flexible and robust soft-error testing system for microelectronic devices and integrated circuits [J] . 王晓辉, 杨振雷, 童腾, 核技术（英文版） . 2015,第003期
• 3. Electrochemical Properties of Polypyrrole-Coated Microelectrode Array and the Fabrication of Polypyrrole-Based Microelectronic Devices [J] . 高等学校化学研究：英文版 . 1995,第002期
• 4. Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices [J] . I. Dutta, C. Park, J. Vella Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2006,第1a2期
• 5. Effect of Stress on Interconnect Reliability of Microelectronic Devices [J] . Young-Bae Park, Insu Jeon Journal of Korean Institute of Metal and Materials . 2004,第8期
• 6. Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices [J] . C.Park, I.Dutta, K.A.Peterson, Journal of Electronic Materials . 2003,第10期
• 7. Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices [C] . Chih Chen, Chien-Min Liu, Tien-Lin Lu, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference . 2016
• 8. Modeling of Photonic Devices and Photonic Integrated Circuits for Optical Interconnect and RF Photonic Front-End Applications [D] . Wang, Binhao. 2016
• 9. On-chip wireless silicon photonics: from reconfigurable interconnects to lab-on-chip devices [O] . Carlos García-Meca, Sergio Lechago, Antoine Brimont, 2017
• 10. Applications of advanced nanomaterials to microelectronic and photonic devices [O] . Chang, Shoou-Jinn, Meen, Teen-Hang, Prior, Stephen D., 2015

• 1. Photonic devices based on thin-film lithium niobate on insulator [J] . Shuai Yuan ,Changran Hu ,An Pan . 半导体学报：英文版 . 2021,第4期
• 2. Photoic crystal nanobeam cavity devices for on-chip integrated silicon photonics [J] . Daquan Yang ,Xiao Liu ,Xiaogang Li . 半导体学报：英文版 . 2021,第2期
• 3. 基于微电子互连应用的无铅高频感应加热重熔技术研究 [C] . 徐鸿博 ,李明雨 ,张丽卿 . 2008中国电子制造技术论坛 . 2008
• 4. 基于子结构方法的微电子集成电路封装互连焊球可靠性的建模与仿真 [A] . 刘飞 . 2010