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WHITE LED PACKAGING STRUCTURE AND WHITE LIGHT SOURCE SYSTEM

机译:白光LED封装结构和白光光源系统

摘要

Provided is a white LED packaging structure, comprising: a substrate, LED chips and a wavelength conversion material layer, wherein the LED chips have at least two types of wavelengths; a peak wavelength of the first type of LED chips is between 385 nm and 425 nm; a peak wavelength of the second type of chips is greater than the peak wavelength of the first type of LED chips; a peak wavelength of an emission spectrum of the wavelength conversion material layer is between 440 nm and 700 nm; and the wavelength conversion material layer absorbs light emitted from the LED chips, so as to emit a white light source.
机译:提供了一种白色LED封装结构,包括:基板,LED芯片和波长转换材料层,其中,LED芯片具有至少两种波长;第一类LED芯片的峰值波长在385nm至425nm之间。第二类型芯片的峰值波长大于第一类型LED芯片的峰值波长;波长转换材料层的发射光谱的峰值波长在440nm至700nm之间。波长转换材料层吸收LED芯片发出的光,从而发出白光源。

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