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IMPROVING DEFECT LOCATION ACCURACY USING SHAPE BASED GROUPING GUIDED DEFECT CENTERING
IMPROVING DEFECT LOCATION ACCURACY USING SHAPE BASED GROUPING GUIDED DEFECT CENTERING
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机译:使用基于形状的分组引导的缺陷定位提高缺陷定位的准确性
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摘要
Defect location accuracy can be increased using shape based grouping with pattern-based defect centering. Design based grouping of defects on a wafer can be performed. A spatial distribution of the defects around at least one structure on the wafer, such as a predicted hot spot, can be determined. At least one design based defect property for a location around the structure can be determined. The defects within an x-direction threshold and a y-direction threshold of the structure may be prioritized.
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