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Epitaxial multilayer structure for GaN-based high electron mobility transistors and a transistor containing this structure

机译:用于GaN基高电子迁移率晶体管的外延多层结构和包含该结构的晶体管

摘要

An epitaxial multilayer semiconductor structure suitable for use in nitride e-HEMT structures having an electron channel layer (3) consisting of an unsupported GaN, over which is a barrier layer adjacent the electron channel (4). According to the invention, the barrier layer is a combination of layers (5.6) of binary AlN and GaN semiconductors. Binary semiconductors and the interfaces between them form an effective barrier especially for the back diffusion of Mg atoms from the GaN backing layer into the electron channel (4). The barrier structure abuts the electron channel (4) in each case by the AlN layer (5), but from above it can be terminated by both the GaN layer (6) and the AlN layer (5). The barrier may comprise a single or more GaN / AlN pairs, may be of greater thickness than conventional AlGaN layer barriers. The epitaxial multilayer semiconductor structure according to the invention is particularly suitable for an electron channel transistor which is closed without applied voltage.
机译:适用于氮化物e-HEMT结构的外延多层半导体结构,该结构具有由非支撑GaN组成的电子通道层(3),在该通道上方是与电子通道(4)相邻的势垒层。根据本发明,阻挡层是二元AlN和GaN半导体的层(5.6)的组合。二元半导体及其之间的界面形成有效的势垒,特别是对于Mg原子从GaN背层向电子通道(4)的反向扩散。势垒结构在每种情况下都通过AlN层(5)邻接电子通道(4),但是从上方它可以同时被GaN层(6)和AlN层(5)终止。势垒可以包括单个或多个GaN / AlN对,可以具有比常规AlGaN层势垒更大的厚度。根据本发明的外延多层半导体结构特别适合于没有施加电压而闭合的电子沟道晶体管。

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