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utilization of phosphate fertilizer industry byproduct in metal leaching on printed circuit boards
utilization of phosphate fertilizer industry byproduct in metal leaching on printed circuit boards
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机译：磷肥工业副产品在印刷电路板金属浸出中的利用
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摘要
The development of a printed circuit board copper (pci) extraction process is disclosed with a leaching solution containing, in addition to hydrogen peroxide (h2o2) and sulfuric acid (h2so4), fluosilicic acid (h2sif6). by-product of the phosphate fertilizer industry. The PCs are initially subjected to a pretreatment for removal of electronic components and volume reduction. Copper leaching is then performed using 5 grams of cellular printed circuit boards in 4 hours of treatment at 25 ° C using 12.5 ml H2SO4, 2.5 ml H2SO4 and 35 ml H2O2 in the solution composition. The electrochemical recovery of copper is obtained in 30 min, 0.25 mol l-1 sodium sulfate (na2so4) and 2.5 a. X-ray diffraction analyzes of the recovered material showed a diffractogram with copper oxide (cu2o) peaks according to the jcpds 78-2076 crystallographic chart. Through scanning electron microscopy (mev) technique, two materials with different morphologies were observed. Through x-ray dispersive energy analysis (edx), it was found that in the elemental composition of the structured material there is a higher percentage of copper (94.55%) than in the particulate (77.44%).
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机译：公开了一种用浸出液开发印刷电路板铜（pci）提取工艺的方法，该浸出液除了过氧化氢（h2o2）和硫酸（h2so4）外还包含氟硅酸（h2sif6）。磷肥工业的副产品。首先对PC进行预处理，以移除电子组件并减小体积。然后在25°C下使用12.5 ml H2SO4、2.5 ml H2SO4和35 ml H2O2在25°C下处理4小时，使用5克多孔印刷电路板进行铜浸出。 30分钟，0.25 mol -1硫酸钠（na2so4）和2.5 a的铜的电化学回收率。根据jcpds 78-2076晶体学图，对回收的材料进行X射线衍射分析，显示出具有氧化铜（cu2o）峰的衍射图。通过扫描电子显微镜（mev）技术，观察到两种具有不同形态的材料。通过X射线色散能量分析（edx），发现结构化材料的元素组成中铜的百分比（94.55％）比颗粒中的百分比（77.44％）更高。
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