首页> 外国专利> RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR DATA SIGNAL CONTACTS OF PACKAGE DEVICES; VERTICAL GROUND SHIELDING STRUCTURES AND SHIELD FENCING OF VERTICAL DATA SIGNAL INTERCONNECTS OF PACKAGE DEVICES; AND GROUND SHIELDING FOR ELECTRO OPTICAL MODULE CONNECTOR DATA SIGNAL CONTACTS AND CONTACT PINS OF PACKAGE DEVICES

RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR DATA SIGNAL CONTACTS OF PACKAGE DEVICES; VERTICAL GROUND SHIELDING STRUCTURES AND SHIELD FENCING OF VERTICAL DATA SIGNAL INTERCONNECTS OF PACKAGE DEVICES; AND GROUND SHIELDING FOR ELECTRO OPTICAL MODULE CONNECTOR DATA SIGNAL CONTACTS AND CONTACT PINS OF PACKAGE DEVICES

机译：包装设备数据信号触点的RLINK接地屏蔽连接结构和阴影消除;包装设备的垂直地面屏蔽结构和垂直数据信号互连的屏蔽功能;光学模块连接器数据信号接触和包装设备接触针的接地屏蔽

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摘要

A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical “signal” interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia). The ground shielding for the electro-optical module may include patterns of ground isolation shielding attachments and contacts.

机译：垂直接地隔离的封装设备可以包括（1）接地屏蔽连接结构和用于数据信号触点的阴影空隙; （2）垂直接地屏蔽结构和垂直数据信号互连的屏蔽栅; （3）封装装置的电光模块连接器的接地屏蔽。这些减少了封装设备的数据信号触点，连接结构和垂直“信号”互连之间的串扰。接地屏蔽附接结构可以包括焊料凸块和/或表面接触的图案。阴影空隙可能在接地平面中的空隙周围，该空隙大于数据信号焊料凸点。垂直接地屏蔽结构可包括垂直数据信号互连之间的接地屏蔽互连的图案：屏蔽栅栏可包括接地镀通孔（PTH）和微孔（uVia）的图案。电光模块的接地屏蔽可包括接地隔离屏蔽附件和触点的图案。

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公开/公告号US2018331043A1

专利类型
公开/公告日2018-11-15

原文格式PDF
申请/专利权人 INTEL CORPORATION;
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申请/专利号US201515774257
发明设计人 YU AMOS ZHANG;ZHIGUO QIAN;KEMAL AYGUN;YIDNEKACHEW S. MEKONNEN;GREGORIO R. MURTAGIAN;SANKA GANESAN;EDUARD ROYTMAN;JEFF C. MORRISS;
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申请日2015-12-26
分类号H01L23/538;H01L23/66;H01L23/552;
国家 US
入库时间 2022-08-21 12:06:05

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