首页> 外国专利> METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, THREE-DIMENSIONAL STRUCTURE WITH PLATED-LAYER PRECURSOR LAYER, THREE-DIMENSIONAL STRUCTURE WITH PATTERNED PLATED LAYER, ELECTROCONDUCTIVE LAMINATE, TOUCH SENSOR, HEAT GENERATING MEMBER, AND THREE-DIMENSIONAL STRUCTURE

METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, THREE-DIMENSIONAL STRUCTURE WITH PLATED-LAYER PRECURSOR LAYER, THREE-DIMENSIONAL STRUCTURE WITH PATTERNED PLATED LAYER, ELECTROCONDUCTIVE LAMINATE, TOUCH SENSOR, HEAT GENERATING MEMBER, AND THREE-DIMENSIONAL STRUCTURE

机译：导电层压板，三维结构，带前板层的三维结构，三维层压板，导电层板，触摸式传感器，发热元件和三维结构的生产方法

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摘要

An object of the present invention is to provide a method for easily producing an electroconductive laminate having a three-dimensional shape and having a metal layer disposed thereon (for example, an electroconductive laminate having a three-dimensional shape including a curved surface and a metal layer disposed on the curved surface). Another object of the present invention is to provide a three-dimensional structure with a plated-layer precursor layer, a three-dimensional structure with a patterned plated layer, an electroconductive laminate, a touch sensor, a heat generating member, and a three-dimensional structure.;The method for producing an electroconductive laminate of the present invention has a step of obtaining a three-dimensional structure with a plated-layer precursor layer including a three-dimensional structure and a plated-layer precursor layer disposed on the three-dimensional structure and having a functional group capable of interacting with a plating catalyst or a precursor thereof and a polymerizable group; a step of applying energy to the plated-layer precursor layer to form a patterned plated layer; and a step of subjecting the patterned plated layer to a plating treatment to form a patterned metal layer on the plated layer.

机译：本发明的目的是提供一种容易地制造具有三维形状并在其上设置有金属层的导电性层压体的方法（例如，具有包括曲面和金属的三维形状的导电性层压体的方法）。层放置在曲面上）。本发明的另一个目的是提供一种具有镀层前体层的三维结构，具有带图案的镀层的三维结构，导电层合物，触摸传感器，生热构件以及三层结构。本发明的导电层压体的制造方法具有以下步骤：获得三维结构，该三维结构具有包括三维结构的镀层前体层和设置在三维结构上的镀层前体层。尺寸结构并具有能够与电镀催化剂或其前体相互作用的官能团和可聚合基团;将能量施加到镀层前体层以形成图案化的镀层的步骤;对该图案化镀覆层进行镀覆处理以在该镀覆层上形成图案化金属层的步骤。

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公开/公告号US2018371619A1

专利类型
公开/公告日2018-12-27

原文格式PDF
申请/专利权人 FUJIFILM CORPORATION;
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申请/专利号US201816119799
发明设计人 NAOKI TSUKAMOTO;
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申请日2018-08-31
分类号C23C18/18;C23C18/38;H05K1/02;H05K3/46;H05K3/06;
国家 US
入库时间 2022-08-21 12:08:27

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