Flexible Packaging Substrates Compromising Thermally-Stable Prints

• 1. 包含热稳定印花的柔性包装基材 [P] . 中国专利： CN108602372B . 2020.04.24
• 2. 包含热稳定印花的柔性包装基材 [P] . 中国专利： CN108602372A . 2018-09-28
• 3. Flexible packaging substrates compromising thermally-stable prints [P] . 美国专利： US10486452B2 . 2019-11-26

  机译： 柔性包装基材损害了热稳定的印刷品

• 4. FLEXIBLE PACKAGING SUBSTRATES COMPRISING THERMALLY-STABLE PRINTS [P] . EP3419832B1 . 2021-10-06

  机译： 柔性包装基板，包括热稳定印刷品

• 5. Flexible packaging substrates comprising thermally-stable prints [P] . IL260913A . 2020-08-31

  机译： 包含热稳定印刷品的软包装基材

• 1. Highly Conductive Fractal-structured Silver Particles for Preparing Flexible Printed Circuits via Screen Printing [J] . Sufeng Zhang, Chen Hua, Bin He, 造纸与生物质材料：英文版 . 2021,第002期
• 2. Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board [J] . Park Jung-Kab, Shin Jin-Ha, Jung Mun-Gi, Journal of nanoscience and nanotechnology . 2015,第10期
• 3. NuDot~® Screening Improves Flexo Print Quality and Press Performance on Flexible Packaging Substrates [J] . Package printing . 2004,第8期
• 4. Enabling Low Cost Flexible Smart Packaging System With Internet-of-Things Connectivity via Flexible Hybrid Integration of Silicon RFID Chip and Printed Polymer Sensors [J] . Zhou Haoyu, Li Siying, Chen Sujie, IEEE sensors journal . 2020,第9期
• 5. Polyester film substrates have been widely used in making relatively simple membrane touch switches and other flexible / printed electronic devices for over 30 years, yet since the early 2000's there has been an ever increasing desire to use "additive" printed electronics to replace "subtractive" etched circuitry in more complex, high performance, high value products. The ability to use flexible substrates in Roll-to-Roll productionSubstrates: Po [C] . Scott Gordon Web Coating and Handling Conference . 2016
• 6. Inkjet Printed Microelectrodes on Flexible Substrates and Its Applications [D] . Kim, Yoontae. 2018
• 7. Stone Paper as a New Substrate to Fabricate Flexible Screen-Printed Electrodes for the Electrochemical Detection of Dopamine [O] . Codruta Varodi, Florina Pogacean, Marin Gheorghe, 2020
• 8. Printing Technologies on Flexible Substrates for Printed Electronics [O] . Sílvia Manuela Ferreira Cruz, Luís A. Rocha, Júlio C. Viana 2018

• 1. Effects of Substrate Temperature on the Properties of Zn-ln-Sn-O Films Deposited on Flexible PES Substrate [J] . Gi-Seok Heo ,Jae-Cheol Park ,Byeong-Yun Oh . 材料科学与工程：中英文A版 . 2011,第005期
• 2. Highly Conductive Fractal-structured Silver Particles for Preparing Flexible Printed Circuits via Screen Printing [J] . Sufeng Zhang ,Chen Hua ,Bin He . 国际造纸 . 2021,第002期
• 3. Packaging Printing is an Important Branch of Printing Industry [J] . . 印刷工业 . 2017,第011期
• 4. Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors [J] . Shi Bai ,Shigang Zhang ,Weiping Zhou . 安徽地质 . 2017,第004期
• 5. 熔喷非织造用聚乳酸/尼龙11双组份生物基材料的结晶性能、热稳定性和相形态 [C] . ZHU Feichao ,朱斐超 ,YU Bin . 中国纺织工程学会化纤专业委员会2016年年会暨中国化纤科技大会 . 2016
• 6. 介孔氧化硅基材料水热稳定性的研究以及新型介孔碳基材料的合成与应用 [A] . 李强 . 2010