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Portable, liquid free, electroless, electrochemical deposition of metal on conductive and nonconductive surfaces

机译:在导电和非导电表面上的便携式,无液体,无电,化学沉积金属

摘要

Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.
机译:通过在固态电解质块中形成金属盐和聚合物溶液作为粘合剂,并通过在极少水或无水且没有电势/功率的情况下将固态电解质块摩擦或刷到表面上,将金属沉积在表面上,从而实现化学镀资源。固体电解质块也是适形的/可模制的,并可用于通过无电沉积工艺将金属沉积到导电和非导电表面上。

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