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Portable, liquid free, electroless, electrochemical deposition of metal on conductive and nonconductive surfaces
Portable, liquid free, electroless, electrochemical deposition of metal on conductive and nonconductive surfaces
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机译:在导电和非导电表面上的便携式,无液体,无电,化学沉积金属
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摘要
Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.
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