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Cover electric conduction powder, the manufacturing method for covering electric conduction powder, conductive adhesive and adhesive structure body including covering electric conduction powder

机译:包覆导电粉,包覆导电粉的制造方法,导电胶及包括包覆导电粉的胶粘结构体

摘要

PROBLEM TO BE SOLVED: To provide covered conductive powder in which the surfaces of conductive particles are covered with titanium oxide without causing the destruction and deformation of the conductive particles, the covered film of titanium oxide is flexible, and also, dispersibility is excellent.SOLUTION: Provided is covered conductive powder in which the surfaces of conductive particles obtained by forming a metal film on the surfaces of core material particles are covered with titanium oxide precipitated from an alkaline solution containing peroxotitanic acid. As the conductive particles, the ones obtained by covering the surfaces of the core material particles made of a resin material with a metal film made of gold, silver, copper, nickel, palladium or solder are preferable.SELECTED DRAWING: Figure 1
机译:解决的问题:要提供一种被覆的导电粉末,其中导电颗粒的表面被氧化钛覆盖,而不会引起导电颗粒的破坏和变形,则被覆盖的氧化钛薄膜具有柔韧性,并且分散性也极好。 :提供一种覆盖的导电粉末,其中通过在包含过氧钛酸的碱性溶液中沉淀的氧化钛覆盖通过在芯材颗粒的表面上形成金属膜而获得的导电颗粒的表面。作为导电性颗粒,最好是用金,银,铜,镍,钯或焊料制成的金属膜覆盖树脂材料制成的芯材颗粒表面,然后再选择导电性颗粒。图1

著录项

  • 公开/公告号JP6469817B2

    专利类型

  • 公开/公告日2019-02-13

    原文格式PDF

  • 申请/专利权人 日本化学工業株式会社;

    申请/专利号JP20170214633

  • 申请日2017-11-07

  • 分类号H01B5;H01B1;H01B1/22;H01B5/16;H01B13;H01R11/01;C09J201;C09J9/02;C09J11;B32B27;B32B27/18;

  • 国家 JP

  • 入库时间 2022-08-21 12:18:35

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